ATLANT3DTM TECHNOLOGY

First ever on-demand atomic layer advanced manufacturing technology based on hybrid Microreactor Selective Area Direct Atomic Processing (μSADALP™)*

Redefining microfabrication

We enable on-demand next-generation micro and optoelectronics printing on simple and complex surfaces atom-by-atom.

MEMS and Integrated Sensors, Microfluidics and Lab-on-Chip, RF-devices,  Optical and Photonic Devices, Quantum and Energy-Harvesting/Storage Devices can be developed with ATLANT3D™ technology with previously impossible functionality and speed at a fraction of a cost.

Unique ATLANT3D™ technology allows
- Rapid atomic layer prototyping and manufacturing
- Highly selective atomic layer patterning
- Excellent 2D/3D conformal deposition on simple and complex surfaces
- Combining multiple materials with excellent compatibility
- Excellent pattern adhesion to almost any surfaces
- Digital and atomically precise control over the printing process
- With possibility to apply up to 450 different commercially available materials

Contact us to learn more about our technology.

Highly conformal Direct Atomic Patterning at   industrially graded materials on flat, corrugated and porous surfaces, with micrometer scale lateral and nanometer vertical precision.

Gas combination

ATLANT3D™ Technology involves mixing gas precursors and reactants for deposition of atomically precise patterns of various materials
So far we tested with our technology the following materials:
TiO2, Pt, ZnO, SiO2.
And it is continuously updated.
A full list of available materials for testing and process development upon customer request can be found via this link.

Gas combination

ATLANT3D™ Technology involves mixing gas precursors and reactants for deposition of atomically precise patterns of various materials
So far we tested with our technology the following materials:
TiO2, Pt, ZnO, SiO2.
And it is continuously updated.
A full list of available materials for testing and process development upon customer request can be found via this link.

Multistack printing

Our ATLANT3D™  μSADALP™ technology allows to print conformally different materials, enabling:
- High-quality multistack patterns and layers for complex devices
- Cross-geometrical printing
Print resolution:
- 400 μm lateral resolution (20-400 um in development)
- Atomic monolayer (0.2 nm) vertical resolution

Complex surfaces

ATLANT3D™ Technology allows unprecedented selective patterning on flat, corrugated and porous surfaces:
-
With surface roughness up to 20 μm*
- Microfluidics channels and optical gratings
- Nanostructure surfaces (nanopillar, nanograss etc.)

Substrate materials can be adapted based upon customer requirements.

Complex surfaces

ATLANT3D™ Technology allows unprecedented selective patterning on flat, corrugated and porous surfaces:
-
With surface roughness up to 20 μm*
- Microfluidics channels and optical gratings
- Nanostructure surfaces (nanopillar, nanograss etc.)

Substrate materials can be adapted based upon customer requirements.

Applications

Advanced materials

Advanced packaging

MEMS and Sensors

Biochemical microreactors

Printed electronics

Energy devices

EMI shielding (5G)

Optics & Photonics

Use case example: Lab-on-Chip

ATLANT3D™ technology allows previously impossible geometrical design and 93% faster and cheaper processing.

*Calculated for single device based on standard lithography and thin film deposition procedures, as compared to ATLANT 3D print tests

ATLANT3D™
technology Process Flow

Conventional UV Lithography Process Flow

Request technical specifications here.

*We developed μSADALP™ (Microreactor Selective Area Direct Atomic Layer Processing/Printing) patent-pending technology that provides highly conformal, direct material writing, and removal with atomic precision and material versatility.

ATLANT 3D Nanosystems

Diplomvej 378
2800 Kongens Lyngby
Denmark

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