Unique ATLANT3D™ technology allows
- Rapid atomic layer prototyping and manufacturing
- Highly selective atomic layer patterning
- Excellent 2D/3D conformal deposition on simple and complex surfaces
- Combining multiple materials with excellent compatibility
- Excellent pattern adhesion to almost any surfaces
- Digital and atomically precise control over the printing process
- With possibility to apply up to 450 different commercially available materials
Contact us to learn more about our technology.
Highly conformal Direct Atomic Patterning at industrially graded materials on flat, corrugated and porous surfaces, with micrometer scale lateral and nanometer vertical precision.
ATLANT3D™ Technology involves mixing gas precursors and reactants for deposition of atomically precise patterns of various materials
So far we tested with our technology the following materials:
TiO2, Pt, ZnO, SiO2.
And it is continuously updated.
A full list of available materials for testing and process development upon customer request can be found via this link.
ATLANT3D™ Technology involves mixing gas precursors and reactants for deposition of atomically precise patterns of various materials
So far we tested with our technology the following materials:
TiO2, Pt, ZnO, SiO2.
And it is continuously updated.
A full list of available materials for testing and process development upon customer request can be found via this link.
Our ATLANT3D™ μSADALP™ technology allows to print conformally different materials, enabling:
- High-quality multistack patterns and layers for complex devices
- Cross-geometrical printing
Print resolution:
- 400 μm lateral resolution (20-400 um in development)
- Atomic monolayer (0.2 nm) vertical resolution
ATLANT3D™ Technology allows unprecedented selective patterning on flat, corrugated and porous surfaces:
- With surface roughness up to 20 μm*
- Microfluidics channels and optical gratings
- Nanostructure surfaces (nanopillar, nanograss etc.)
Substrate materials can be adapted based upon customer requirements.
ATLANT3D™ Technology allows unprecedented selective patterning on flat, corrugated and porous surfaces:
- With surface roughness up to 20 μm*
- Microfluidics channels and optical gratings
- Nanostructure surfaces (nanopillar, nanograss etc.)
Substrate materials can be adapted based upon customer requirements.
ATLANT3D™ technology allows previously impossible geometrical design and 93% faster and cheaper processing.
*Calculated for single device based on standard lithography and thin film deposition procedures, as compared to ATLANT 3D print tests
ATLANT3D™
technology Process Flow
Conventional UV Lithography Process Flow
*We developed μSADALP™ (Microreactor Selective Area Direct Atomic Layer Processing/Printing) patent-pending technology that provides highly conformal, direct material writing, and removal with atomic precision and material versatility.
Diplomvej 378
2800 Kongens Lyngby
Denmark
