Processing on a broad range of substrates


 ATLANT 3D technology can be applied on a variety of substrates allowing for a broad range of applications to be possible. One of the advantages is that the technique is applicable on some rough or complex substrates which are sometimes different from patterns using standard lithography techniques.


Already now we have tested our Pt and TiO2 processes on a range of complex substrates. The process is seen to work well and print uniformly on flat surfaces, gratings (with depths smaller than 100 µm), complex corrugation like carbon nanograss and black silicon, anodized aluminum oxide membranes, and curvatures, see Figure 3-5.

Figure 3. Black Si needles surface coated with 20/300/600/1000 passes of Pt.400-800 nm corrugation.
Figure 4.Edge of printed Pt line deposited on Carbon nanograss.
Figure 5. Conformal deposition of Platinum on 20 µm wide, 15 µm deep Siliconmicrochannels. Further tests were done with widths ranging from 5-500 µm. Aspect ratio of 1:25 was reached on the thinnest channels.

The direct ALD printing process has also been tested on a range of substrate materials already. As a standard, we work with Silicon and glass wafers and the latest results also prove the development of an a low-temperature version of our TiO2 process for deposition on polymer substrate. This can be a great advantage within the biomedical area where temperature-sensitive polymer substrates are often used. Furthermore, the process has been tested on sapphire, Silicon Carbide, Gallium Nitride, generally OH-terminated surfaces.

Figure 6 shows selected samples with prints of TiO2 on various substrates. 
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