%20no%20nozzle.png)
>> DOWNLOAD TECH SPECIFICATION
4 different precursors and 4 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test
The stage of NanofabricatorTM 1 can accommodate wafers up to 4’’ and other shapes under 100x100 mm
The NanofabricatorTM 1 stage can move up to 100mm/s, with a deposition speed dependent on the sample and process specifications
>> DOWNLOAD TECH SPECIFICATION
6 different precursors and 6 different reactants can be loaded at the same time, allowing you to quickly switch between the materials you wish to deposit or test
The stage of NanofabricatorTM 2 can accommodate wafers up to 6’’ / 12’’ and other shapes under 150x150 mm / 300x300 mm
The NanofabricatorTM 2 stage can move up to 500mm/s, with a deposition speed dependent on the sample and process specifications
• Rapid functional devices prototyping
• Small-batch prototyping & iterating
• Direct-write technology
• Rapid testing of new materials
• Material characterization
• Quality evaluation of materials
• Developing material compounds
Added functionalities on microdevices, such as: Integrated sensors, Surface texturing, Selective area protective coating, Selective area optical coating, Chip surgeryping & iterating, Direct-write technology
.jpeg)
.jpeg)
400 µm now, 25 µm in development, 1 µm long term goal
Multiple materials can be deposited sequentially
Path defined processing
Variable from 0.1 mm/s up to 100 mm/s (Based on sample and process specifications)
High quality material deposition
Selective surface doping possible
RT – 300°C
Possible to process several materials sequentially out of 150* possible
Conformal deposition on any type of surface with corrugation up to 25 µm
Atmospheric or controlled ambient
Tested on Pt process
Post process hollow structure development
>> CLICK HERE
>> CLICK HERE