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ATLANT 3D

Academia & Research

NANOFABRICATOR™ LITE

Discover the most versatile & powerful tool ever created to accelerate advanced material innovation, rapid process testing & device development with atomic precision.​​ Experience the unprecedented flexibility & material versatility!

Up to 2 Materials simultaneously

Down to 100 µm Line Width

Sample size up to 100 mm

Deposition speed up to 200 mm/s

DALP®. ATLANT 3D’s Microreactor Direct Atomic Layer Processing technology offers maskless process flexibility and unparalleled prototyping speed – reducing the time of design iterations, resource dependencies and overall cost of innovation.

Multi-material. Enabling multi-material deposition in one process, tested on a wide range of advanced materials, independent of surface roughness and substrate sensitivity with multi-shape deposition and a high degree of thickness control.

NANOFABRICATOR™ LITE. Suitable for a wide range of applications such as MEMS and sensors, optics, photonics, advanced packaging, microelectronics as well as emerging applications. Designed as a compact and versatile tool to seamlessly integrate into your lab infrastructure.

DALP® Technology

REDEFINING MICROFABRICATION

We enable on-demand next-generation microdevices printing on simple and complex surfaces atom-by-atom. The NANOFABRICATOR™ LITE is the most compact tool ever created to accelerate materials, processes and device innovation with atomic precision.

It is suitable for a wide range of applications such as MEMS, devices, optics, photonics, packaging, RF & electronics and quantum devices which can be developed with ATLANT 3D technology with previously impossible functionality and speed at a fraction of a cost.

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PARADIGM SHIFTING PROCESS

ATLANT 3D’s proprietary DALP® – DIRECT ATOMIC LAYER PROCESSING technology is enabling a paradigm shift across the whole value chain from advanced material innovation to advanced manufacturing of industrial solutions.

 CURRENT PROCESS

PHOTOLITHOGRAPHY-BASED PROCESS

The existing standard in the fabrication industry, photolithography-based processes, demand extensive infrastructural support and time. Typically, a minimum of 10 processing loops involving around 40 distinct machines are required, necessitating a large-scale operational setup.

The entire process cycle usually extends over a period of at least one month. Furthermore, this method is not without its drawbacks: it poses significant environmental hazards, incurs high capital expenditures (CAPEX) and operational expenses (OPEX), and is characterized by lengthy innovation cycles. This traditional approach, while established, faces challenges in terms of efficiency, sustainability, and agility in response to evolving technological needs.

 ATLANT 3D’S PROCESS

DIRECT ATOMIC LAYER PROCESSING

ATLANT3D’s DALP®, or Direct Atomic Layer Processing, streamlines microfabrication by combining multiple processes into one compact machine, reducing processing time to just 1-2 days.

Key advantages include:

  • Enhanced Process Flexibility: Tailors to diverse applications.
  • Significant Cost Reduction: Lowers capital and operational expenses.
  • Wide Material Compatibility: Supports various ALD process materials.
  • Accelerated R&D and Prototyping: Speeds up development from concept to prototype.
  • Innovative Device Structure Development: Enables new device architectures.
  • Efficient Single-Wafer Processing: Omits traditional lithography
  • enhancing precision and efficiency.
 HOW WE DO IT

SIMPLIFYING THE WHOLE PROCESS

The whole process from experiment design to obtaining samples can take hours with several various DOE parameters. The processed sample has completed DOE with multiple parameter variations including thicknesses, temperatures, and materials.

01

PREPARING DIGITAL PATTERN FILE

This step involves creating a detailed digital blueprint of the desired pattern. It requires precise design work to ensure that the specifications of the pattern are accurately represented and ready for processing.

02

DEFINING DOE PROCESS FLOW AND FILES

In this phase, a systematic approach is taken to plan the experiment. It includes defining the process parameters and conditions, setting up the necessary files, and ensuring that all variables are considered for a successful outcome.

03

UPLOADING BLANK SUBSTRATE

Here, a blank substrate is loaded into the NANOFABRICATOR™ LITE. This substrate serves as the base material on which the processing will be carried out, according to the predefined digital pattern and DOE parameters.

04

DIRECT ATOMIC LAYER PROCESSING

This step signifies the completion of the processing phase. The substrate, now imprinted with the desired pattern through the Nanofabricator’s precise atomic layer processing, is ready for inspection and further use.

05

PROCESSED SAMPLE COMPLETED

This final stage involves the core technology of the NANOFABRICATOR™ LITE. It precisely adds or removes material at an atomic scale, following the digital pattern and DOE guidelines, to create the final micro- or nano-structured sample.

Expanding Horizons

Diverse Advanced Applications

The NANOFABRICATOR™ LITE enables advanced material innovation, rapid process testing, and device development across multiple advanced applications. It exemplifies a paradigm shift across diverse industrial landscapes. Explore how our cutting-edge equipment is advancing industries by offering precision, efficiency, and versatility in nanofabrication.

DISCOVER APPLICATIONS

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DALP® Technology

Rapid, flexible & versatile atomically precise processing

Our patent pending rapid and direct atomic layer processing technology DALP® offers rapid material and process development and testing, maskless process flexibility, and unparalleled prototyping speed, reducing the time of design iterations, resource allocation and cost of innovation. ​

​NANOFABRICATOR™ LITE enables multi-material deposition in one process, tested on a wide range of advanced materials, independent of surface roughness and substrate sensitivity with multi-shape deposition and a high degree of thickness control. ​

Our Technology
⸺ Our Solutions

Line Width

400 µm now, 25 µm in development, 1 µm long term goal

Temperature

Operates in a temperature range from room temperature (RT) up to 300°C

Process speed

Variable from 0.1 mm/s up to 100 mm/s (based on sample and process specifications)

Versatile Materials Platform

Possible to process several materials sequentially out of 150* possible.

Environment

Open atmospheric conditions or within controlled ambient environments

Hybrid processing

Direct additive and subtractive processing

Selective Area Deposition

Path-defined processing for targeted deposition of materials

Surface geometry

Conformal deposition on any type of surface with corrugation up to 25 µm

Multimaterial stack printing

Multiple materials can be deposited sequentially

Crystalline Material

Growth High quality material deposition

Selective nanoparticle deposition

Tested with platinum (Pt) processes

Hollow microstructuring

Post process hollow structure development

PROCESS INNOVATION INSIGHTS

DALP® represents a quantum leap in process innovation, encapsulating direct patterning with remarkable process flexibility. It advances the understanding of material deposition, addressing the complexities of cross-sectional line profiles and the intrinsic nature of atomic growth. The DALP® excels in the deposition on intricately contoured surfaces, negating the necessity for vacuum environments — thereby streamlining the manufacturing workflow and enhancing the efficiency of material innovation.

SURFACE STRUCTURATION

Staircase with 0.3 nm step height and 3 microns step width.

Smooth 1.5 nm height valleys repeated.

Tapered shape structure.

Cross-sectional line profile and growth nature

Characterization of self-limiting surface chemistry and digital growth in DALP®. Thicknesses are determined for two distinct DALP® materials by ellipsometry.

Abstract: Small Methods 2022, 2101546, https://doi.org/10.1002/smtd.202101546 ​​

CONFORMALITY

Cross-section of platinum deposition for capacitive sensor in the 20 µm channel. The EDX scans shown to the right indicate conformal deposition of platinum along the sidewalls.

Direct patterning & process flexibility

The DALP® system demonstrates its capacity to engineer patterns with atomic precision, facilitating the creation of complex microscale structures.

SUBSTRATE VERSATILITY

ALD conformality and low T. deposition enables processing sensitive and rough substrates. Silicon/SiC/GaN wafers. Glass/Fused silica/borosilicates. Polymer.

CONFORMALITY

A. “Anodic” aluminum oxide macropores coated with Pt. B. Nanostructured black Si surface coated Pt different thickness. C. Si trench coated with a Pt carbon nanograss. D. Aligned Si trenches coated with a perpendicular line of TiO2

 Sustainability

Setting New Benchmarks in Sustainable Manufacturing

At ATLANT 3D, we are not just changing how things are made; we are redefining the principles of manufacturing. Our commitment to sustainability is a testament to our belief that responsible innovation and business practices can create a positive impact on the world, paving the way for a more sustainable future in manufacturing and beyond.

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 Nanofabricator™ LITE

Technical Specification

Substrate

  • Size: up to 4″ (100mm)
  • Substrate Handling​: Wafer
  • Maximum thickness: 10 mm
  • Z direction shape: Flat
  • Holding method: Vacuum
  • Loading: Manual
  • Heater temperature: max. 300°C
  • Heater temp. uniformity: +/- 1%

Process Chamber

  • Environment: Ambient**** Uncontrolled
  • Processing speed*: up to 200 mm/sec
  • Deposition area: up to 1.5 mm from wafer edge
  • DALP® resolution: 400 μm standard

Gas system

  • Precursor temperature: RT – 150°C
  • Nr. of precursor bubblers: 2**
  • Nr. of reactant bubblers: 1** (H2O***)
  • Nr. of gas reactants: 1**

Options

  • Environment: Inert***** Controlled
  • Additional precursor bubblers: **
  • Additional reactant bubblers: **
  • Additional gas reactants: **

* Dependent on materials to be deposited and customer needs.

** Additional number of bubblers and reactants dependent on customer needs.

*** Additional reactant types dependent on customer needs.

**** Clean room, CLASS 8 min recommended.

***** Argon recommended.

Questions & Answers

Delve into the comprehensive FAQs to explore the NANOFABRICATOR™ LITE’s capabilities, applications, and technical prowess. From handling diverse substrates to offering customizable features and ensuring precise control, this guide covers everything you need to know about this groundbreaking device.

The NANOFABRICATOR™ LITE is designed for advanced material innovation, offering capabilities like rapid material testing, direct patterning, device structure development, and multi-material process testing.

It’s ideal for applications in MEMS & Sensors, Optics, Photonics & Novel Displays, Advanced Packaging, RF & Microelectronics, and Emerging Applications.

DALP™, or Microreactor Direct Atomic Processing, is a hybrid technology enabling on-demand atomic layer manufacturing. It allows for precise printing of microdevices on various surfaces, offering functionality and speed at a reduced cost​​.

Yes, it incorporates both Temporal ALD, which involves sequential pulse sequences for precursor and co-reagent delivery, and Spatial ALD, which offers spatial separation of these elements with increased deposition speed.

Yes, it is capable of processing on diverse substrates like Silicon/SiC/GaN Wafers, Polymers, Glass, Fused Silica, and Borosilicates.

It is proven to achieve smooth conformal deposition on complex surfaces like “Anodic” aluminum oxide macropores, nanostructured black Si surfaces, Si trenches, and aligned Si trenches with a surface roughness of up to 25 µm.

The device accommodates 2″ to 4″ wafers, has a maximum thickness of 10 mm, ambient uncontrolled processing environment, and a deposition area up to 15mm from the wafer edge.

Yes, the NANOFABRICATOR™ LITE is designed to be flexible and can be adapted to specific project requirements.

The system offers atomic scale thickness variability and precise gradient control for accurate material deposition.

It operates in an ambient uncontrolled environment, but specific conditions can depend on the materials being deposited.

It is designed to seamlessly integrate into lab infrastructures.

ATLANT 3D offers comprehensive support for the NANOFABRICATOR™ LITE, including training and technical assistance.

Capabilities

Explore more questions about the NANOFABRICATOR™ LITE, where we delve into its advanced material testing, device structure development, and diverse gas handling capabilities. Learn about its pivotal role in photonics, optics, RF & Microelectronics, and emerging technologies, along with its proficiency in handling complex surfaces. Discover how its ambient processing environment and adaptability make it a perfect fit for both research and production settings, backed by ATLANT 3D’s comprehensive post-purchase support.

The NANOFABRICATOR™ LITE excels in rapid material testing, enabling precise exploration of new materials and swift development of innovative processes, crucial for cutting-edge research and development.

It facilitates the development of complex device structures by allowing multi-material deposition in a single process. This feature is vital for industries like semiconductor manufacturing and photonics, where intricate device architectures are commonplace.

Yes, it is equipped to handle a variety of precursor gases, essential for diverse material processing. This versatility is key in experimenting with new material combinations and properties.

In photonics and optics, the NANOFABRICATOR™ LITE is instrumental in developing novel display technologies and advanced optical components by enabling precise control over material properties at the nanoscale.

Its advanced technology allows for uniform material deposition on various surface geometries, including non-planar substrates, critical for applications in advanced microelectronics and MEMS.

The system’s design allows potential integration with automated workflows, particularly in production environments.

The NANOFABRICATOR™ LITE operates with proprietary software designed to control its advanced features and functionalities. This software includes modules for process control, monitoring, and maintenance.

The integrated software is essential for optimizing the deposition processes, enabling precise control over parameters such as material flow, deposition rates, and layer thickness. It may also include analytical tools for process evaluation and improvement.

The system could be configured for remote monitoring and control, depending on user requirements and security considerations.

In RF & Microelectronics, the NANOFABRICATOR™ LITE’s ability to precisely control material properties and layer thicknesses is vital for developing high-frequency components with enhanced performance.

Emerging applications like quantum computing, advanced sensors, and next-generation energy storage technologies can significantly benefit from the precision and versatility offered by the NANOFABRICATOR™ LITE.

The ability to operate in an ambient environment allows for more flexible and practical integration into various research and production settings, reducing the need for specialized controlled environments.

Absolutely, its design caters to both R&D labs and production lines, offering flexibility in scaling from prototype development to full-scale production.

We are providing ongoing support, including operational training, technical assistance, and maintenance services, ensuring customers can fully leverage the capabilities of the NANOFABRICATOR™ LITE.

Specification

Explore the NANOFABRICATOR™ LITE’s capabilities, from achieving precise line widths to performing multimaterial stack printing and selective area deposition. Discover its impressive process speed range and ability to handle crystalline material growth, along with direct additive and subtractive processing.

It currently offers a line width of 400 µm, with development for 25 µm underway, aiming for a 1 µm line width in the long term.

Yes, it can sequentially deposit multiple materials, enabling complex multilayer structures.

Yes, it allows for precise selective area deposition through path-defined processing.

The process speed of it varies from 0.1 mm/s to 100 mm/s, depending on specific sample and process requirements.

It is capable of high-quality crystalline material deposition, crucial for advanced microfabrication.

It provides both direct additive and subtractive processing, enhancing its material fabrication versatility.

It operates across a temperature range from room temperature (RT) to 300°C.

Yes, it ensures conformal deposition on surfaces with corrugation up to 25 µm.

Selective nanoparticle deposition, particularly with Pt processes, has been successfully tested with it.

It also includes the capability for post-process development of hollow structures.

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