Introducing

NANOFABRICATOR™ Lite


Discover the most versatile and powerful tool ever created to accelerate advanced material innovation, rapid process testing and device development with atomic precision.​​

Experience the unprecedented flexibility and material versatility of NANOFABRICATOR™ Lite.​
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Experience atomic precision

We invite you to experience the NANOFABRICATOR™ Lite and its capabilities in action – from atomic scale thickness variability to multi-cycle and multi-material deposition. Contact our team to book a demo.

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A PARADIGM-SHIFTING PROCESS​

ATLANT 3D’s proprietary DALP™ – DIRECT ATOMIC LAYER PROCESSING technology is enabling a paradigm shift across the whole value chain from advanced material innovation to advanced manufacturing of industrial solutions.

Current Photolithography-based process
ATLANT 3D DALP™ ​
DIRECT ATOMIC LAYER PROCESSING​
LEARN more about dalpTM technology

KEY FEATURES​

Precursor testing and validation ​
Rapid material testing and process development
Patterning and device structure development
Multi-material process development and testing​
DISCOVER CAPABILITIES​

MULTIPLE ADVANCED APPLICATIONS​

NANOFABRICATOR™ Lite enables advanced material innovation, rapid process testing and device development across multiple advanced applications.

Advanced material innovation
Rapid prototyping
applications
MEMS
& Sensors
Optics, Photonics & Novel Displays​
Advanced
Packaging
RF & Microelectronics
Emerging applications
MEMS & Sensors
Optics, Photonics & Novel Displays​
Advanced Packaging
RF & Microelectronics
Emerging Applications

ATOMIC LAYER PROCESSING TECHNOLOGY EVOLUTION

ATLANT 3D’s proprietary DALP™ technology is accelerating advanced material innovation to enable advanced process and device development. ​​​
TEMPORAL ALD
Sequential pulse sequence for precursor and co-reagent delivery. Time base separation of reagents.​
SPATIAL ALD
Spatial separation of precursor and co-reagent with increased deposition speed. Physical distance separation of reagents.​
ATLANT 3D DALP™ ​
DIRECT ATOMIC LAYER PROCESSING​


Microfluidic precursor delivery concept: Schematic view of the delivery nozzle in frontal view (top) and in cross-section (lower panel).​
see more of the DALPTM technology

CAPABILITIES

Rapid, flexible & versatile atomically precise processing

​Our patent pending rapid and direct atomic layer processing technology DALP™ offers rapid material and process development and testing, maskless process flexibility, and unparalleled prototyping speed, reducing the time of design iterations, resource allocation and cost of innovation. ​
​NANOFABRICATOR™ Lite enables multi-material deposition in one process, tested on a wide range of advanced materials, independent of surface roughness and substrate sensitivity with multi-shape deposition and a high degree of thickness control. ​
Direct patterning & complex designs with arbitary shapes
Atomic scale thickness
variability & precise gradient control
Depositions on complex surface geometries & sensitive materials
Broad material versatility
e.g. dielectrics and metals
Micrometer scale line width
No vaccum required
see results

PROCESS INNOVATION INSIGHTS

CUSTOM SOLUTIONS​​

Our team of highly skilled engineers and scientists with extensive expertise in material and process R&D, advanced application development and system engineering are here to help with any questions you may have. ​

CONTACT US​

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