We invite you to experience the NANOFABRICATOR™ Lite and its capabilities in action – from atomic scale thickness variability to multi-cycle and multi-material deposition. Contact our team to book a demo.
ATLANT 3D’s proprietary DALP™ – DIRECT ATOMIC LAYER PROCESSING technology is enabling a paradigm shift across the whole value chain from advanced material innovation to advanced manufacturing of industrial solutions.
Current Photolithography-based process
ATLANT 3D DALP™ DIRECT ATOMIC LAYER PROCESSING
Our patent pending rapid and direct atomic layer processing technology DALP™ offers rapid material and process development and testing, maskless process flexibility, and unparalleled prototyping speed, reducing the time of design iterations, resource allocation and cost of innovation.
NANOFABRICATOR™ Lite enables multi-material deposition in one process, tested on a wide range of advanced materials, independent of surface roughness and substrate sensitivity with multi-shape deposition and a high degree of thickness control.
Direct patterning & complex designs with arbitary shapes
Atomic scale thickness variability & precise gradient control
Depositions on complex surface geometries & sensitive materials
Broad material versatility e.g. dielectrics and metals
Our team of highly skilled engineers and scientists with extensive expertise in material and process R&D, advanced application development and system engineering are here to help with any questions you may have.